GS-GPU-11Engineering datasheet

AMD Instinct MI300X

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Verified2026-10-14
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The Instinct MI300X is AMD's CDNA 3 accelerator, an OAM module with 192 GB of HBM3 at 5.3 TB/s, 304 compute units and a 750 W peak board power, launched 6 December 2023. AMD positions it against the H100 on memory capacity. Eight modules join over Infinity Fabric on a standard OAM baseboard. GPU Smith specs it for inference-heavy deployments where 192 GB per GPU and available capacity matter more than newest-generation datatypes; it has no FP4 or FP6.

192 GB HBM3 ECC
Memory · 8192-bit
5.3 TB/s
Memory bandwidth · peak
2.61 PFLOPS
FP8 matrix · dense; 5.22 PFLOPS with sparsity
1.3 PFLOPS
FP16 / BF16 matrix · dense; 2.61 PFLOPS with sparsity
163.4 TFLOPS
FP64 matrix · vector 81.7 TFLOPS
750 W peak
Board power · OAM, 54V UBB
Compute01/05
ArchitectureCDNA 3 · TSMC 5nm / 6nm FinFET
Compute units304
Stream processors19,456
Matrix cores1,216
Peak engine clock2,100 MHz
FP8 matrix2.61 PFLOPS · dense; 5.22 with structured sparsity
FP16 / BF16 matrix1.3 PFLOPS · dense; 2.61 with structured sparsity
TF32 matrix653.7 TFLOPS · 1.3 PFLOPS with sparsity
INT82.6 POPS · 5.22 with structured sparsity
FP32163.4 TFLOPS · matrix and vector
FP6481.7 TFLOPS vector · 163.4 TFLOPS matrix
Transistors153 billion
Memory02/05
Capacity192 GB HBM3 · full-chip ECC
Interface8192-bit · 5.2 GHz memory clock
Bandwidth5.3 TB/s · peak
Last-level cache256 MB · Infinity Cache
Interconnect & form factor03/05
Form factorOAM module · passive
Host busPCIe 5.0 x16
Infinity Fabric links8 · 128 GB/s peak per link
Power & thermal04/05
Board power (TBP)750 W peak
Power delivery54V UBB
CoolingPassive OAM · air-cooled in the host chassis
Software & platform05/05
Software stackROCm
Launch date6 December 2023 · per AMD product page
RASPage retirement, page avoidance · SR-IOV supported
Field notes
  • 192 GB per GPU lets a 70B model in FP16 (about 140 GB of weights, by arithmetic) fit on one GPU with room for KV cache, which was the point of the part against 80 GB H100s.
  • FP8 is the lowest precision with matrix hardware; there is no FP6 or FP4, so quantised throughput gains stop at 8-bit versus MI350 series.
  • FP64 matrix at 163.4 TFLOPS is high for the class, which matters if the same cluster also runs HPC.
  • AMD's comparison charts against H100 use AMD's own calculations; benchmark your model rather than relying on ratios.
  • At 750 W peak it is the lowest-power OAM part among the AMD Instinct sheets here, which eases chassis cooling.
Questions we get on this part

How much memory does the MI300X have?

192 GB of HBM3 at 5.3 TB/s peak bandwidth with full-chip ECC.

MI300X vs MI325X?

Same CDNA 3 compute (304 CUs, 2.61 PFLOPS FP8); the MI325X raises memory to 256 GB HBM3E at 6 TB/s and board power to 1,000 W.

What is the MI300X power draw?

AMD lists 750 W peak typical board power, delivered over 54V UBB.

Does the MI300X support FP4?

No. FP8 is its lowest-precision floating-point matrix datatype; MXFP4 and MXFP6 arrive with the MI350 series.