GS-GPU-08Engineering datasheet

AMD Instinct MI355X

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Verified2026-10-14
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The Instinct MI355X is AMD's flagship 4th-gen CDNA accelerator, an OAM module with 288 GB of HBM3E at 8 TB/s, 256 compute units, and a 1,400 W board power rating, launched 12 June 2025. It is the high-power member of the MI350 series, adds MXFP6 and MXFP4 datatypes, and is built for 8-GPU OAM baseboards joined by Infinity Fabric. GPU Smith specs it as the AMD alternative to B200 and B300 class parts for training and large-model inference, where 288 GB per GPU removes much of the parallelism a smaller-memory part needs.

288 GB HBM3E ECC
Memory · full-chip ECC
8 TB/s
Memory bandwidth · peak
10.1 PFLOPS
MXFP4 / MXFP6 matrix · dense, peak theoretical
5 PFLOPS
FP8 matrix · OCP-FP8, dense; 10.1 PFLOPS with sparsity
78.6 TFLOPS
FP64 · vector and matrix
1,400 W
Board power · typical board power (TBP)
Compute01/05
ArchitectureCDNA 4 · TSMC 3nm / 6nm FinFET
Compute units256
Stream processors16,384
Matrix cores1,024
Peak engine clock2,400 MHz
MXFP4 / MXFP6 matrix10.1 PFLOPS · dense
MXFP8 / OCP-FP8 matrix5 PFLOPS · dense; 10.1 PFLOPS with structured sparsity
FP16 / BF16 matrix2.5 PFLOPS · dense; 5 PFLOPS with structured sparsity
INT8 matrix5 POPS · dense; 10.1 POPS with structured sparsity
FP32157.3 TFLOPS · vector and matrix
FP6478.6 TFLOPS · vector and matrix
Transistors185 billion
Memory02/05
Capacity288 GB HBM3E · full-chip ECC
Bandwidth8 TB/s · peak
Last-level cache256 MB · Infinity Cache
RASPage retirement, page avoidance · SR-IOV supported
Interconnect & form factor03/05
Form factorOAM module
Host busPCIe 5.0 x16
Infinity Fabric links7 · 153 GB/s peak per link, scale-up
Scale-out link1 per GPU · 128 GB/s peak
Power & thermal04/05
Board power (TBP)1,400 W
CoolingPassive & Active · as listed by AMD; confirm air vs liquid per OEM platform
Software & platform05/05
Software stackROCm
Launch date12 June 2025 · per AMD product page
Cloud availabilityVultr, Oracle · reported, as of March 2026
Field notes
  • 288 GB per GPU is the headline advantage over smaller-memory parts: by arithmetic, a 70B model in FP16 (about 140 GB of weights) fits on one GPU.
  • Peak PFLOPS are theoretical at the 2,400 MHz clock and at the datatype named; sustained throughput at 1,400 W depends on cooling and power capping.
  • MXFP4 and MXFP6 need framework and kernel support. Verify your serving stack uses them on CDNA 4 before counting on the 10.1 PFLOPS figure.
  • The scale-out link is one 128 GB/s port per GPU, so multi-node fabric design (NIC choice, topology) is a separate decision from the node.
  • ROCm maturity is the risk, not the silicon: pilot your exact model and framework versions on rented hardware first.
Questions we get on this part

How much HBM does the MI355X have?

288 GB of HBM3E at 8 TB/s peak bandwidth, with full-chip ECC.

What is the MI355X power draw?

AMD lists 1,400 W typical board power for the OAM module.

MI355X vs B200?

On AMD's published peaks the MI355X has more memory (288 GB) and bandwidth (8 TB/s). Delivered performance depends on software; AMD's comparison figures are its own calculations, so benchmark your workload.

Can I buy a single MI355X?

It is an OAM module sold on 8-GPU platforms through OEMs; AMD's PCIe option in this generation is the MI350P.