Dell Technologies vs HPE for NVIDIA AI servers.

Side by side from our vendor index: what each firm actually designs, which NVIDIA platforms it ships, and the identity facts that shape a procurement decision. Sources and full detail live on each profile.

Global OEMs

Dell Technologies

The largest enterprise channel for NVIDIA compute. Dell engineers the PowerEdge XE series and IR7000 rack infrastructure itself, and wraps it in the supply chain, services and financing a regulated enterprise expects. Lead times track demand from its largest AI customers.

HeadquartersRound Rock, Texas, USA
Founded1984
Ownershippublic (NYSE: DELL)
Revenue$113.5B (FY2026, ended Jan 2026)
PlatformsGB200 NVL72, GB200 NVL4, HGX H100/H200/B200, HGX B200, Vera Rubin NVL72, PCIe
Designs in-house
  • Integrated Rack 7000 (IR7000): own 21-inch ORv3-based rack platform purpose-built for liquid cooling, up to 480kW per rack, near 100% heat capture
  • Own direct-to-chip liquid cooling design with cold plates, integrated busbars and DLC manifolds built into the IR7000
  • iDRAC: in-house embedded management controller with silicon root of trust; factory OpenBMC option
  • Custom 1RU compute sleds engineered for the XE9712 GB200 NVL72 rack-scale system
Flagship NVIDIA systems
PowerEdge XE9712GB200 NVL72 · DLC
PowerEdge XE8712GB200 NVL4 · DLC
PowerEdge XE9680HGX H100/H200/B200 · air
PowerEdge XE9680LHGX B200 · DLC
Global OEMs

HPE

HPE brings the Cray lineage to enterprise AI: genuine in-house direct-liquid-cooling engineering proven on exascale systems, applied to ProLiant and Cray XD NVIDIA platforms up to GB300 NVL72 scale. Strong where the buyer wants supercomputing discipline with OEM support.

HeadquartersSpring, Texas, USA
Founded2015
Ownershippublic (NYSE: HPE)
Revenue$34.3B (FY2025, ended Oct 2025)
PlatformsHGX H100/H200, GB200 NVL72, GB300 NVL72, PCIe, Vera Rubin NVL72
Designs in-house
  • Cray supercomputing heritage (acquired 2019): the source of HPE's HPC and DLC engineering stack
  • Industry's first 100% fanless direct liquid cooling architecture (Oct 2024): 8-element design covering GPU, CPU, blade, storage, fabric, rack, pod and CDU; claims 90% cooling-power reduction vs air
  • Slingshot: proprietary Cray-developed interconnect used in DOE exascale systems
  • iLO BMC: HPE designs its own iLO ASIC with silicon root of trust
Flagship NVIDIA systems
HPE Cray XD670HGX H100/H200 · air or DLC
NVIDIA GB200 NVL72 by HPEGB200 NVL72 · DLC
NVIDIA GB300 NVL72 by HPEGB300 NVL72 · DLC
ProLiant Compute DL380a Gen12PCIe · air
Which one for your build?

The right vendor depends on the workload, the facility and the timeline, not the brand. The assessment sizes both against your requirements and returns quoted pricing, with our margin disclosed.

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